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Adhesive Guru AG110 Mold Release Spray is an aerosol spray based on silicone that prevents
materials from sticking to molds. All you need to do is spray the Mold Release Spray onto your mold to create a thin layer before pouring the material. Afterward, it allows for easy removal of the finished piece. With its special dispenser, you can achieve excellent results while using less product. This spray can also help prolong the life of your molds by preventing sticking and tearing. It is easy to use, contains high-quality ingredients, and leaves you with an excellent product and intact molds.
Adhesive Guru AG110 Mold Release Spray is an excellent choice for almost any project that involves molding material. Silicone mold release spray for epoxy resin molds used for silicone molds, candle molds, wax, and urethanes. This spray is easy to use, features high-quality ingredients & leaves you with a great product and intact molds.
The high level of silicone in our Adhesive Guru Mold Release for epoxy resin ensures that your epoxy projects don’t stick to your molds. Due to its silicone content, it offers heat resistance, and making it suitable for use in hot molds.
It is the perfect addition to your craft room or tool shed and is suitable for use with silicone, metal, plaster, resin, polyester, plastic, ceramic, concrete, and rubber molds. The special formula ensures that your projects come out exactly the way you want! Not recommended for use on dirty and damp molds.
Use this mold release agent to prevent rips. Silicone molds tend to be fragile when used for molding projects. Non-stick silicone lubricant prevents sticking. It is colorless and odorless. Using our Adhesive Guru Silicone Spray Mold Release when creating projects can help prolong the life of your molds by preventing sticking.
Our aerosol spray applicator makes using the releasing agent a breeze. Simply coat the mold in our casting release spray before casting the project. After drying, the mold release allows for easy removal of the finished part from the mold.